WHITE LIGHT INTERFEROMETER FOR HIGH PRECISION WAFER INSPECTIONProduct Technology
The IMS5420 is a high-performance white light interferometer for non-contact thickness measurement of monocrystalline silicon wafers. The controller has a broadband superluminescent diode (SLED) with a wavelength range of 1,100 nm. This enables the thickness measurement of undoped, doped and highly doped SI wafers with only one measuring system. The IMS5420 achieves a signal stability of less than 1 nm. The thickness can be measured from a distance of 24 mm.
Due to the optical transparency of silicon wafers in the wavelength range of 1.100 nm, the IMS5420 interferometers can precisely detect the thickness. In this wavelength range, both undoped silicon and doped wafers provide sufficient transparency. Therefore, wafer thicknesses up to 1.05 mm can be detected. The measurable thickness of the air gap is even up to 4 mm.
The IMS5420 interferometer enables the thickness measurement of undoped, doped and highly doped silicon wafers and thus offers a wide range of applications. This wafer thickness measuring system is ideal for the measurement of monocrystalline silicon wafers with a geometric thickness of 500 to 1050 µm and a doping of up to 6 m Ω cm. Even with highly doped wafers, thicknesses up to 0.8 mm can be measured. This results from the decreasing transparency with increasing doping.
Precise thickness measurement during lapping
In wafer fabrication, a crystalline silicon ingot is cut into thin slices of about 1 mm. The discs are then ground and lapped to obtain the desired thickness and surface finish. To achieve high process stability, interferoMETERs are used for inline thickness measurement in lapping and grinding machines. Due to its compact design, the sensor can also be integrated in confined installation spaces. The thickness values are used for machine control as well as for quality control of the wafer.
Model
Measuring range /
Start of measuring range
Linearity
Number of measurable layers
Fields of application
IMS5420-TH24
0.05 ... 1.05 mm (for silicon, n=3.82)
0.2 ... 4 mm (for air, n=1) / approx. 24 mm with a working range of approx. 6 mm
< ±100 nm
1 layer
Inline thickness measurement, e.g. after grinding or polishing.
IMS5420MP-TH24
< ±100 nm for one layer
< ±200 nm for additional layers
up to 5 layers
Inline thickness measurement, e.g. for quality control of the coating thickness after coating
IMS5420/IP67-TH24
< ±100 nm
1 layer
Industrial inline thickness measurement during lapping and grinding
Modern interfaces for integration into machines and systems
The controller offers integrated interfaces such as Ethernet, EtherCAT and RS422 as well as additional encoder connections, analog outputs, synchronization inputs and digital I/Os. When you use Micro-Epsilon's interface modules, PROFINET and EthernetIP are available. This allows the interferometer to be integrated into all control systems and production programs.
What is the Measuring principle of turbo charger speed measurement sensor?
A sensing coil integrated in the sensor housing is energized by a high-frequency alternating current. The emerging electromagnetic field changes when sensing a turbo charger blade, every blade generates a pulse. The controller identifies the rotational speed (analog 0 - 5 V) by counting the number of blades.
What is the measuring principle of 3D laser scanner?
scanCONTROL 3D scanners are used for precise inline 3D measurements in numerous applications. Scans are performed by moving the scanner or the target. Due to their low weight, the scanners are ideally suited both for robotic applications and inline production monitoring. These 3D laser scanners are characterized by high dynamics, absolute precision and their compact size. With the scanCONTROL 3000 and the new scanCONTROL 3002 series, Micro-Epsilon offers a comprehensive portfolio with numerous measurement areas, Red and Blue laser technologies and extensive accessories.
The scanCONTROL 3D laser scanners are based on the latest GigE Vision and GenICam standards and can therefore be integrated into a wide range of image processing environments. The powerful 3DInspect software is available for parameter setting, evaluation and output.
Characteristics
Real 3D point clouds without data loss during post-processing
Fast 3D scans up to 10,000 Hz
Compact design for all measurement areas
Small and compact, ideal for robotic applications
Available with red and blue laser line
GenICam / GigE Vision standard for easy integration
Powerful 3DInspect software for measurement, processing and evaluation as well as assessment of measured data
Compatible with Cognex VisionPro
3D laser scanners for inline applications
The scanCONTROL 3D scanners feature a wide range of different measurement areas from 25 x 15 mm up to 200 x 300 mm. Regardless of the size of the measurement area, these laser scanners impress with fast measurements and high precision at the same time.
The variety of measurement areas allows, on the one hand, both the acquisition of smallest details and structures, and, on the other hand, the measurement of large objects with a large offset distance. For this reason, scanCONTROL 3D scanners are used in various industries.
3D scans for integrators and end users
For the integration into the customer’s environment and image processing programs, the scanCONTROL 3D scanners offer a comprehensive SDK (Software Development Kit) based on the industry standards GigE Vision and GenICam. The unique Valid3D technology enables lossless display and processing of the 3D point clouds.
The scanCONTROL 3D scanners can be operated with the powerful 3DInspect software. Numerous tools, automation functions and interfaces enable the creation, processing and output of measured values based on real 3D point clouds.
What is the measuring principle of reflectCONTROL sensor?
reflectCONTROL is intended for shape measurements of shiny objects. This sensor displays a striped pattern which is mirrored by the surface of the measuring object into the sensor cameras. The sensor provides a 3D image of the surface which allows for the topology of the components (e.g. flatness, deflection, curvature) to be determined. reflectCONTROL is specially optimized for measurement and inspection tasks, e.g., in production lines. Moreover, the sensor has a GigE Vision interface that offers GenICamcompliant data.
Nanometer-accurate thickness measurement of undoped, doped and highly doped wafers
