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3D Profile Unit – Smart 3D evaluation and results output of stitched 2D/3D profile data
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The 3D Profile Unit enables the calculation of several individual profiles of scanCONTROL 30xx sensors in a common coordinate system. This is how a composite 2D profile or a composite 3D point cloud can be generated. So the detection of various geometries, the extension of measuring ranges and the performance of thickness measurements is possible. The exact assignment of the position of the sensor to the position of the measurement object can be carried out via the integrated encoder inputs.
The evaluation of the data and the parameterization of the system can be implemented in the 3DInspect software. The 3D Profile Unit controller has an integrated evaluation feature in conjunction with the Industrial Ethernet connection, enabling the application to be controlled and measured values to be output to a PLC. Alternatively, the 3D Profile Unit controller can also be integrated into common image processing programs via GigE Vision and acts as a raw data provider.
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3DInspect: Powerful software for all Micro-Epsilon 3D sensors
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3DInspect is a standardized and user-friendly software tool for the 3D Profile Unit. This software can directly parameterize the 3D Profile Unit and record the measured data. Powerful tools allow point cloud alignment and filtering, intuitive detection and selection of relevant areas, and program combination. The 3D point clouds can be processed as required and measured values can be output to the controller. |
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Generation and transfer of stitched 2D/3D profile data: 3DPU-X
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3DPU-X is a system that converts the profile data of several scanCONTROL sensors into a common coordinate system and makes it available as 2D profiles / 3D point clouds via GigE Vision.
Direct integration into image processing and 3D software | Communication with any GigE Vision clients | Transfer of profile data or 3D point clouds
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Smart 3D evaluation and result output of stitched 2D/3D profile data: 3DPU-X/IE
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3DPU-X/IE is a system that converts the profile data of several scanCONTROL sensors into a common coordinate system, evaluates the 2D profiles / 3D point clouds and makes the measured values available via integrated fieldbus interfaces, e.g. as good or bad results.
Integrated evaluation and configuration via 3DInspect | Industrial Ethernet interface for control and transfer of measured values | Transfer of measured values and measurement results
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Micro-Epsilon registration targets for automatic registration
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Automatic registration: Registration with registration target in a common coordinate system |
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Individual sensor readings are brought into a common coordinate system during the set-up process |
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Manual registration: Registration via golden sample |
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With multi-sensor registration, the position of each individual scanCONTROL sensor is determined and transferred to a common overall coordinate system. Registration brings the individual sensor readings into a common coordinate system during the set-up process.
Micro-Epsilon offers an individual registration target for each measuring range of the scanCONTROL sensors and for each measuring arrangement. A special registration target can be designed for individual configurations and measurement setups. The sensors can also be registered without a registration target using a golden sample.
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Applications
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Thickness of smartphone carrier plates |
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Width measurement on cold-rolled sheet metal |
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Pin test on automotive connectors |
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Thickness measurement of rolled steel strips |
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High Performance Micrometer for the Highest Demands
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The optoCONTROL 2700 is a compact LED micrometer for the precise measurement of diameter, gap, edge and segment. The micrometer is characterized by its high accuracy with a measuring range of 40 mm. As the controller is integrated in the receiver, the cabling and installation work is reduced to a minimum.
Thanks to the active inclination correction, objects tilted by up to 45° are also detected extremely precisely. The configuration is performed conveniently via the web interface and enables the parameters set up of video signal, filter and different measuring modes. In set-up mode, a shadow image can be used for simple alignment of the measuring object. The excellent price-performance ratio rounds off the service package.
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Active tilt correction of the measuring object
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The optoCONTROL 2700 detects the exact alignment and angle of the measuring object. Thanks to the integrated evaluation, the measured value is automatically adjusted to the inclination of the measuring object. As a result, the exact measurement value is output. The inclination correction is available for the diameter measuring programs. The detected image can be output via the web interface and checked visually.
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Angle measurement of the object
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If objects are not exactly at a 90° angle in the measuring range, the optoCONTROL 2700 can precisely determine and output the inclination up to 45°. |
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Simple operation via web interface and presets for common applications
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The entire configuration of the optoCONTROL 2700 is performed without additional software via an easy-to-use web interface. The web interface is accessed via an Ethernet connection and enables quick and easy setting of e.g. averaging, measuring rate or presets and offers extensive parameterization options for every measurement task. With just one click, the stored presets enable quick and easy parameterization of the sensor specifically for the measurement task. |
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Black and white image for easy alignment with the measuring object
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The exact positioning of the measuring object in the light beam is quick and easy thanks to the set-up mode. The measuring object can be easily set up using the integrated black and white image. This saves the user time and effort when setting up and adjusting the exact position. The mid of the measuring range is shown in both axes by a red line.
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Application examples
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Modern interfaces for integration into machines and systems
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WHITE LIGHT INTERFEROMETER FOR HIGH PRECISION WAFER INSPECTION  Product Technology
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The IMS5420 is a high-performance white light interferometer for non-contact thickness measurement of monocrystalline silicon wafers. The controller has a broadband superluminescent diode (SLED) with a wavelength range of 1,100 nm. This enables the thickness measurement of undoped, doped and highly doped SI wafers with only one measuring system. The IMS5420 achieves a signal stability of less than 1 nm. The thickness can be measured from a distance of 24 mm. |
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Due to the optical transparency of silicon wafers in the wavelength range of 1.100 nm, the IMS5420 interferometers can precisely detect the thickness. In this wavelength range, both undoped silicon and doped wafers provide sufficient transparency. Therefore, wafer thicknesses up to 1.05 mm can be detected. The measurable thickness of the air gap is even up to 4 mm.
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The IMS5420 interferometer enables the thickness measurement of undoped, doped and highly doped silicon wafers and thus offers a wide range of applications. This wafer thickness measuring system is ideal for the measurement of monocrystalline silicon wafers with a geometric thickness of 500 to 1050 µm and a doping of up to 6 m Ω cm. Even with highly doped wafers, thicknesses up to 0.8 mm can be measured. This results from the decreasing transparency with increasing doping. |
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In wafer fabrication, a crystalline silicon ingot is cut into thin slices of about 1 mm. The discs are then ground and lapped to obtain the desired thickness and surface finish. To achieve high process stability, interferoMETERs are used for inline thickness measurement in lapping and grinding machines. Due to its compact design, the sensor can also be integrated in confined installation spaces. The thickness values are used for machine control as well as for quality control of the wafer.
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Measuring range /
Start of measuring range |
Linearity |
Number of measurable layers |
Fields of application |
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IMS5420-TH24 |
0.05 ... 1.05 mm (for silicon, n=3.82)
0.2 ... 4 mm (for air, n=1) / approx. 24 mm with a working range of approx. 6 mm |
< ±100 nm |
1 layer |
Inline thickness measurement, e.g. after grinding or polishing. |
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IMS5420MP-TH24 |
< ±100 nm for one layer
< ±200 nm for additional layers |
up to 5 layers |
Inline thickness measurement, e.g. for quality control of the coating thickness after coating |
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IMS5420/IP67-TH24 |
< ±100 nm |
1 layer |
Industrial inline thickness measurement during lapping and grinding |
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The controller offers integrated interfaces such as Ethernet, EtherCAT and RS422 as well as additional encoder connections, analog outputs, synchronization inputs and digital I/Os. When you use Micro-Epsilon's interface modules, PROFINET and EthernetIP are available. This allows the interferometer to be integrated into all control systems and production programs.
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What is the Measuring principle of turbo charger speed measurement sensor?
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A sensing coil integrated in the sensor housing is energized by a high-frequency alternating current. The emerging electromagnetic field changes when sensing a turbo charger blade, every blade generates a pulse. The controller identifies the rotational speed (analog 0 - 5 V) by counting the number of blades.
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Characteristics
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 Large measurement distance up to 2.2 mm
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Speed measurements from 200 to 400,000 rpm
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Operating temperature (sensor) up to 285°C
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Profile stitching of up to 2 laser scanners
