Embedded Computing
 

BY3030

BY3030<font><font color=red>(MOQ 500 pcs)</font></font>

BY3030

Features

Design for Industrial Automation, M2M application 
Intel® Celeron® Processor J1900 2.0 GHz 
1 x SO-DIMM DDR3L 1333(Max up to 8 GB) 
2xGbE, 2xUSB3.0, 2xUSB 2.0, 6xCOM, 1xVGA, 1xHDMI 
2.5” SATA HDD or SSD 
9~36 V DC power input 
up to 8 x COM ports 
Fanless, High efficiency thermal design w/ sealed construction 
-20 to 60 deg.C

System Specification

Processor Intel® Celeron® Processor J1900 2.0GHz 
(turbo boost up to 2.42GHz)
BIOS UEFI
System Memory 1 x SO-DIMM DDR3L 1333 4G (Max up to 8G)
Graphic Chipset Intel® Gen7 Intel Graphics with DX11*, OGL3.2
Ethernet Controller Dual GbE, Realtek RTL8111G-CG, 
10/100/1000 Mbps
Serial 6 x COM Ports (Optional for 8 x COM Ports)
USB 2 x USB 3.0, 2 x USB 2.0
Expansion Slot 1 x Mini PCIe, Half size
Storage Default by 32GB SSD, up to 256GB SSD

I/O Connectors

Front Side I/O 8 x COM ports 
(2 x RS232, 4 x RS422/485 ,optional 2 x RS232) 
1 x 9-36 DC Input
Back Side I/O 1 x Line Out 
2 x USB 3.0 
2 x LAN port 
1 x VGA 
1 x HDMI 
2 x USB 2.0

Mechanical and Environment

Dimensions (L x W) 238mm x 165mm x 55mm 
Construction Aluminum housing
Power Input +9~36V DC Input

Environment Specification

Operating Temperature -20to 60 deg.C
Operating Humidity 5% to 95% (non condensing)
Mounting VESA/Wall-mount/Desktop
Anti-Vibration 5Hz~500Hz /1Grms /3 Axis
Anti Shock 15G, 11ms duration
 
 

 

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