Fragile semiconductor chips require delicate handling prior to packaging. During Through-Silicon Via (TSV), eutectic, epoxy, or solder based die attach processes, consistent force must be applied to the chip. Incorrect force application causes broken chips and incomplete bonds. Load cells incorporated into the die attach tooling enable closed loop control during this delicate process.

One LCM100 Miniature In Line Load Cell paired with Instrumentation (IPM650, IDA100, IAA300 Differential Strain Gauge Amplifier).